POSS-Induced Rheological and Dielectric Modification of Polyethersulfone
Polymer Science and Engineering
Polyhedral oligomeric silsesquioxane (POSS) nanostructured chemicals, when incorporated at low levels in thermoplastics, provide processability enhancement and viscosity reduction without compromising other bulk physical properties. POSS has been relatively unexplored in high performance polymers, and there is incomplete understanding of the mechanisms by which POSS produces flow improvements. In this study, polyethersulfone (PES) was melt-blended with trisilanolphenyl (TSP)-POSS and dodecaphenyl (DP)-POSS; and rheological, dielectric spectroscopy, and scanning electron microscopy evaluations were conducted to identify structure/property/processing relationships. TSP-POSS yielded greater processability improvements and viscosity reductions than DP-POSS, suppressed low temperature relaxations to a larger extent, and displayed a greater degree of nanoscale dispersion in the polymer matrix. The findings are evaluated in terms of competing theories of POSS viscosity reduction.
Journal of Applied Polymer Science
Kemp, L. K.,
Smith, N. A.,
Cross, J. A.,
Nazarenko, S. I.,
Thornell, T. L.,
Newman, J. K.,
Morgan, S. E.
(2021). POSS-Induced Rheological and Dielectric Modification of Polyethersulfone. Journal of Applied Polymer Science, 138(23).
Available at: https://aquila.usm.edu/fac_pubs/18496