Stretchable and Self-Healable Semiconductive Composites Based On Hydrogen Bonding Cross-Linked Elastomeric Matrix

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Polymer Science and Engineering


Semiconductors with both high stretchability and self-healing capability are highly desirable for various wearable devices. Much progress has been achieved in designing highly stretchable semiconductive polymers or composites. The demonstration of self-healable semiconductive composite is still rare. Here, an extremely soft, highly stretchable, and self-healable hydrogen bonding cross-linked elastomer, amide functionalized-polyisobutylene (PIB-amide) is developed, to enable a self-healable semiconductive composite through compounding with a high-performance conjugated diketopyrrolopyrrole (DPP-T) polymer. The composite, consisting of 20% DPP-T and 80% PIB-amide, shows record high crack-onset strain (COS ≈1500%), extremely low elastic modulus (E≈1.6 MPa), and unique ability to spontaneously self-heal atroom temperature within 5 min. Unlike previous works, these unique composite materials also show strain-independent charge mobility. An in-depth morphological study based on multi-model techniques indicate that all composites show blending ratio- and stretching-independent fibril-like aggregation due to the strong hydrogen bond in elastomer to enable the unique stable charge mobility. This study provides a new direction to develop highly healable and electronically stable semiconductive composite and will enable new applications of stretchable electronics.

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Advanced Functional Materials

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